CAPABILITIES

S.No Description Capability
1 Layer Count 2 – 24 Layers
2 Complex Boards 3 / 3 mil with BGA
3 Minimum Hole Dia 4 MIL (0.1 mm)
4 Maximum Board size 480 x 380 mm
5 Board Thickness 0.2 mm to 10 mm
6 Heavy Copper Boards 140 microns
7 Surface Finishes ENIG / HASL (TIN-LEAD)
8 Special Materials Rogers
9 Impedance Control Single and Differential
10 Solder Mask Colors Green, Red, White, Black, Blue
11 Via filling Non Conductive Ink
12 Legend color White
13 Special Profiling PCBs With Multiple Shape Profiles
14 PCBs in Arrays Arrays According to Customer Requirement
15 Special PCBs Blind and Buried Vias
Half PTH Castellated holes
Edge plating